ROBOT200 Endstation
ROBOT
Together with our partner rubitec GmbH, we put our jointly developed, new ROBOT200 end station into operation in our implantation area in the RUBION, ion beam department in September 2020.
The contracted company tribotec-electronic has taken over the executing "master role" in this project. The mechanical plant components as well as the robot and elevator components were implemented by specialized companies through the company tribotec-electronic.
The contracted company tribotec-electronic has taken over the executing "master role" in this project. The mechanical plant components as well as the robot and elevator components were implemented by specialized companies through the company tribotec-electronic.
The assembly and implementation of the beam tube, the end station and the connected components were then carried out in close cooperation with the company tribotec-electronic and our own technical team of the department ion beams/rubitec GmbH.
Beamline and Cleanroom ROBOT200
A CTNR faraday cup at the end of the implantation chamber is used to adjust (focus and center) the non-deflected beam. After this focusing and centering, the deflection voltage is applied and the zero current at the wafer as the deflection voltage reversal point is detected and set with a dc401 dose controller from tribotec-electronic.
The new end station works with the already known and established system components from our HVEC and ROBOT150 systems, which have been in production for many years.
The new end station works with the already known and established system components from our HVEC and ROBOT150 systems, which have been in production for many years.
Here we continue to use the proven scanning of the ion beam for ion implantation with the scanner units (see also HVEC and ROBOT150). As with the HVEC a corner cup system is used for dose measurements.
Endstation ROBOT200
The ROBOT200 system was installed for wafers up to 200mm in diameter. However, it can also accept wafers of other diameters with different holders.
All handling takes place under vacuum conditions. The entire implantation cycle is computerized, fully automated according to a customer-oriented recipe.
One robot chamber each is located to the right and left of the implantation chamber and the two associated elevator chambers. The elevator chambers each contain a carrier that can hold up to 25 wafers.
The robot arm 1 rotates to a selected elevator chamber LF / LE and picks up a wafer A from the carrier. The robot arm 1 rotates with the wafer A in the robot chamber and brings the wafer A into the implantation chamber. There, the wafer A is picked up by the Deposit station. The robot arm 1 moves back out of the implantation chamber. Wafer A is now taken over by the Platen station and placed in the implantation position. Implantation is started. During the implantation of wafer A, the robot arm 1 rotates to the selected lifting unit chambers LF / LE and picks up another wafer B from the carrier. The robot arm 1 rotates with the wafer B in the robot chamber and waits for the transfer step.
After implantation, the wafer A is transferred from the Platen station back to the Deposit station.
The robot arm 2 takes over the wafer A from the Deposit station and turns with the completely implanted wafer A to the elevator chambers RE / RF and deposits it there.
During one pair of load lock chambers (e.g. LE-RE) is in operation, the second pair (e.g. LF-RF) can be ventilated, loaded with new, wafer loaded cassette on the loading side and a new empty cassette can be set on the unloading side.
All handling takes place under vacuum conditions. The entire implantation cycle is computerized, fully automated according to a customer-oriented recipe.
One robot chamber each is located to the right and left of the implantation chamber and the two associated elevator chambers. The elevator chambers each contain a carrier that can hold up to 25 wafers.
The robot arm 1 rotates to a selected elevator chamber LF / LE and picks up a wafer A from the carrier. The robot arm 1 rotates with the wafer A in the robot chamber and brings the wafer A into the implantation chamber. There, the wafer A is picked up by the Deposit station. The robot arm 1 moves back out of the implantation chamber. Wafer A is now taken over by the Platen station and placed in the implantation position. Implantation is started. During the implantation of wafer A, the robot arm 1 rotates to the selected lifting unit chambers LF / LE and picks up another wafer B from the carrier. The robot arm 1 rotates with the wafer B in the robot chamber and waits for the transfer step.
After implantation, the wafer A is transferred from the Platen station back to the Deposit station.
The robot arm 2 takes over the wafer A from the Deposit station and turns with the completely implanted wafer A to the elevator chambers RE / RF and deposits it there.
During one pair of load lock chambers (e.g. LE-RE) is in operation, the second pair (e.g. LF-RF) can be ventilated, loaded with new, wafer loaded cassette on the loading side and a new empty cassette can be set on the unloading side.
This process is repeated until all wafers have been implanted.
Schematic view (top view)
As with our other end stations, the ROBOT200 is also housed in a clean room. If requested by the customer, implantation can be made under Class 100 / ISO Class 5 clean room conditions here.
The first tests for verification and the successful calibration of the system have taken place in close cooperation with our customers from the industry in the third quarter of 2020.
The first tests for verification and the successful calibration of the system have taken place in close cooperation with our customers from the industry in the third quarter of 2020.
The system is therefore available for implantation with immediate effect!